- media@moneyinfocus.news
SK hynix said it plans to invest 19 trillion won (approximately $12.85 billion) to build a new advanced packaging facility in South Korea, aiming to meet rising demand for artificial intelligence memory chips, according to the Seeking Alpha platform.
The investment, disclosed in a regulatory filing, underscores the accelerating global push to expand AI infrastructure.
The company held a groundbreaking ceremony on Wednesday for its P&T7 (Package & Test) plant, to be built in the Cheongju Technopolis Industrial Complex.
According to SK hynix, the facility will specialize in advanced packaging technologies, which are critical for producing high-performance memory products such as high bandwidth memory (HBM)—a key component in AI and high-performance computing systems.
“P&T7 will serve as a core production base to strengthen our leadership in AI memory,” said Byeonggi Lee, head of manufacturing at SK hynix.
The expansion comes as semiconductor manufacturers race to scale capacity amid surging demand driven by AI workloads.
SK hynix is a major supplier of HBM chips to Nvidia, whose dominance in AI processors has fueled demand across the supply chain.
The company competes directly with:
The investment highlights a broader shift in the semiconductor industry, where bottlenecks are increasingly emerging in memory and packaging rather than processing alone.
As AI models grow more complex, the ability to scale HBM production and advanced packaging capabilities is expected to play a decisive role in determining competitive positioning across the global chip market.
